benzocyclobutene resin

Description:

Low dielectric constant and low dielectric loss materials.

Characteristics:

Low moisture absorption,no out-gassing,low temperature cure and excellent planarization.

Application:

Were developed for use as spin-on dielectric materials in microelectronics device fabrication.They have been widely adopted in a variety of electronics applications,interlayer dielectric,flat panel displays,IC packaging,wafer bonding,integrated passives,MEMS and 3D integration,and optoelevtronic components.